JPS6020146U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS6020146U
JPS6020146U JP11300883U JP11300883U JPS6020146U JP S6020146 U JPS6020146 U JP S6020146U JP 11300883 U JP11300883 U JP 11300883U JP 11300883 U JP11300883 U JP 11300883U JP S6020146 U JPS6020146 U JP S6020146U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
adhesive resin
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11300883U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6334277Y2 (en]
Inventor
宮木　昭二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP11300883U priority Critical patent/JPS6020146U/ja
Publication of JPS6020146U publication Critical patent/JPS6020146U/ja
Application granted granted Critical
Publication of JPS6334277Y2 publication Critical patent/JPS6334277Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
JP11300883U 1983-07-20 1983-07-20 混成集積回路装置 Granted JPS6020146U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11300883U JPS6020146U (ja) 1983-07-20 1983-07-20 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11300883U JPS6020146U (ja) 1983-07-20 1983-07-20 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS6020146U true JPS6020146U (ja) 1985-02-12
JPS6334277Y2 JPS6334277Y2 (en]) 1988-09-12

Family

ID=30261764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11300883U Granted JPS6020146U (ja) 1983-07-20 1983-07-20 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS6020146U (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016111047A1 (ja) * 2015-01-08 2016-07-14 株式会社村田製作所 圧電振動部品及びその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122870A (en) * 1978-03-17 1979-09-22 Tokyo Shibaura Electric Co Thick film circuit board
JPS5735354A (en) * 1980-08-13 1982-02-25 Fujitsu Ltd Sealing method for semiconductor housing container

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54122870A (en) * 1978-03-17 1979-09-22 Tokyo Shibaura Electric Co Thick film circuit board
JPS5735354A (en) * 1980-08-13 1982-02-25 Fujitsu Ltd Sealing method for semiconductor housing container

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016111047A1 (ja) * 2015-01-08 2016-07-14 株式会社村田製作所 圧電振動部品及びその製造方法
JPWO2016111047A1 (ja) * 2015-01-08 2017-08-10 株式会社村田製作所 圧電振動部品の製造方法
US10749492B2 (en) 2015-01-08 2020-08-18 Murata Manufacturing Co., Ltd. Piezoelectric vibration component and method for manufacturing the same

Also Published As

Publication number Publication date
JPS6334277Y2 (en]) 1988-09-12

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